Laser Annealing Equipment —— IGBT Backside Annealing Process


SLD500/20

As one of the most widely used power devices, IGBT is applied in the fields of traffic & consumer electronics. Based on the 500 series stepper platform, SLD500 laser annealing is applied in IGBT backside annealing process, supporting annealing depth of 7μm.
   Product Features

● Warped wafer annealing

● Excellent optical system

● Ultra-thin wafer transfer

● Accurate thermal effect control

● High throughput

   Specifications

 Model  SLD500/20
Wafer Type  6/8/12" Wafer
Wafer Thickness  Taiko≥60μm/Non-Taiko≥150μm
Scan Type  Scan & Step