500 Series Stepper —— IC Back-end Advanced Packaging


SSB500/40

SSB500/50

SSB500 series stepper is designed for redistributed layer (RDL) in Wafer Level Packaging (Fan-In WLP, Fan-Out WLP) applications, and advanced packaging processes, especially Filp Chip applications
such as Gold Bump, Solder Bump and Copper. With optional wafer backside alignment (WBA) module, it also meets TSV process requirements in MEMS and 2.5D/3D packaging.
   Product Features

● Supporting exposure on warped wafer and bonded wafer

● Ultra-large field of view (33mm×53.5mm, 44mm×44mm) for high throughput

● Highly accurate overlay

● Double-side alignment available, including methods of IR and visible light measurement

● Precise temperature control for stable production under high energy exposure conditions

   Specifications

 Model

SSB500/40

 SSB500/50

Resolution

 2μm

 1μm

Light Source

 ghi-line/gh line/i-line mercury

 ghi-line/gh line/i-line mercury

Wafer Size

 200mm/300mm

 200mm/300mm

Back-side Alignment

Option

 Option